THE ROLE

The Director of Application Engineering serves as a global leader responsible for driving customer-focused technical engagement with OEMs in the high-performance electronics sector. This role leads a team of engineers who provide expert consultation on PCB stack-up design, materials selection, signal integrity, thermal performance, and qualification test plans. This role is pivotal in translating complex customer requirements into manufacturable, high-performance solutions that align with company strategy and product capabilities.

KEY RESPONSIBILITIES:

Customer-Facing Application Support:

• Lead global engagement with OEMs to support PCB stack-up design, material selection, and performance simulation.
• Act as technical liaison during design-in cycles and new product adoption phases.
• Oversee the creation and validation of design guidelines, test protocols, and material documentation.

Strategic & Technical Leadership:

• Build and execute a global application engineering strategy that supports business growth, product differentiation, and customer satisfaction.
• Collaborate with Product Management, Sales, R&D, and Operations to align on stack-up capabilities, signal integrity, and thermal reliability performance.

Organizational Management:

• Lead, coach, and develop a global team of high-performing application engineers and technical field resources.
• Build scalable processes for stack-up modeling, test plan development, failure analysis interpretation, and simulation methodology.

Technology & Standards Thought Leadership:

• Maintain deep knowledge of advanced materials (high-speed, low-loss laminates, thermally conductive prepregs, etc.).
• Represent the company in standards bodies (IPC, JEDEC, etc.) and customer forums where future requirements are shaped.

Collaboration and Influence:

• Partner with OEM customers to co-develop validation plans, share best practices, and facilitate early engagement on new designs.
• Drive technical alignment across global sites to ensure uniform quality of application engineering services.

QUALIFICATIONS & EXPERIENCE

• 15+ years in Application Design within high-reliability industries such as advanced materials, semiconductors, electronics, automotive, or aerospace.
• Experience working in or with a global laminate or PCB manufacturer.
• Familiarity with IPC/JEDEC or OEM qualification protocols and failure analysis methodologies.

EDUCATION

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a closely related technical field. Preferred Master’s degree (M.S. or M.Eng) in a relevant engineering discipline or MBA with a strong technical undergraduate foundation.
• Continuing education or certifications in signal integrity, thermal management, or high-speed digital design are a plus.

OTHER CONSIDERATIONS

• Fluent in English – Required for all business, technical documentation, and global customer communication.
• Proficiency in Mandarin Chinese – Strongly preferred to support collaboration with OEM customers and internal technical teams in China and Taiwan.
• Additional language skills (e.g., Cantonese or regional dialects) are a plus, but not required.